The TSMC Open Innovation Platform^® Ecosystem Forum is a unique event that brings together the semiconductor design community and TSMC customers. The OIP Forum will feature multi-track technical presentation sessions along with an Ecosystem Pavilion. The Forum provides an ideal venue to build relationships with TSMC customers. We have set the dates for our 2024 global OIP events, each with video on demand (VOD) access after the conclusion of the in-person events.

North America – OIP Ecosystem Forum

Date: Wednesday, September 25

Time: 9:30am – 6pm (Pacific Standard Time)

Venue: Santa Clara Convention Center, CA

Japan – OIP Ecosystem Forum

Date: Friday, October 25

Time: 9:30am – 5:30pm (Japan Standard Time)

Venue: Grand Hyatt Tokyo

Taiwan – OIP Ecosystem Forum

Date: Wednesday, November 6

Time: 9:30am – 4:35pm (Taiwan Time)

Venue: Sheraton Hsinchu Hotel

China – OIP Ecosystem Forum

Date: Wednesday, November 13

Time: 9:30am – 4:35pm (China Standard Time)

Venue: Hyatt Regency Beijing Wangjing

Europe – OIP Ecosystem Forum

Date: Tuesday, November 19

Time: 9:30am – 5:00pm (Central European Time)

Venue: Hilton Amsterdam Airport Schiphol

Israel – OIP Ecosystem Workshop

Date: Tuesday, November 26

Time: 10:30am – 4:30pm (Israel Daylight Time)

Venue: Bar-Ilan University

Call for Paper

The technical sessions at the global OIP Ecosystem Forums are organized into two to three tracks focusing on focusing on 3DFabric, 3Dblox, High-Performance Computing, Mobile, 3DFabric, Automotive, IoT and RF. Each track covers multiple 20 minutes presentations.

Key benefits of participating in TSMC's OIP Ecosystem Forum are:

• Exclusive one-on-one access to TSMC customer executives at the director level or above.
• Increased opportunities to engage in in-depth discussions with TSMC customers from around the globe.

We are seeking paper presentations that illustrate your design solutions and customer successes with TSMC solutions, methodologies, and techniques.
*Priority will be given to joint papers with your customers and region-specific topics.

The Technical Paper Review Committee will review the submitted abstracts, score them based on their merit and their ability to demonstrate how TSMC technology is integrated into your products or services, and make the final selections for in-person presented papers and online-only papers.

Submit an abstract for consideration at the 2024 OIP Ecosystem Forum!

2024 Topics of Interest

There is no charge to present. Abstracts are due June 10, 2024. For more information, please contact Mr. Tom Quan at tquan@tsmc.com.

 

Important Paper Submission Dates:

• Paper abstract and bio submission due - June 10
• Abstract review & final selection – June 10 – June 21
• Notification of selected abstracts - June 28
• Full draft presentation slide submission – Aug 2
• Final presentation slides due – Aug 23
• Final presentation slides recording submission - Sep 2
• Presentation Rehearsal (Recorded Video or Live) - Sep 9 - 18
• OIP Ecosystem Forum NA– Sep 25 – VOD Oct 10
• OIP Ecosystem Forum Japan– Oct 25 – VOD Nov 18
• OIP Ecosystem Forum Taiwan– Nov 6 – VOD Nov 25
• OIP Ecosystem Forum China– Nov 13 – VOD Nov 25
• OIP Ecosystem Forum Europe– Nov 19 – VOD Dec 5
• OIP Ecosystem Workshop Israel – Nov 26

Application Form

Please go to Call for Paper Submission and fill in the form to submit the abstract and speaker biography.

The views expressed in the presentations made at this event are those of the speaker and are not necessarily those of TSMC.