|
Time
|
Plenary Session
|
| 08:30 – 09:30 |
Registration & Ecosystem Pavilion |
| 09:30 – 09:45 |
Welcome Remarks |
| 09:45 – 10:30 |
TSMC Keynote & Guest Speech |
| 10:30 – 11:00 |
Coffee Break & Ecosystem Pavilion |
|
TSMC Technical Talks |
| 11:00 – 11:30 |
3Dblox 2024: Maximize 3DIC Design Productivity
TSMC
|
AI-powered EDA Solutions for Design PPA, QoR and Productivity Enhancement
TSMC
|
|
OIP Partner Technical Talks |
|
HPC & 3DFabric Track |
Mobile, IoT & Automotive Track |
| 11:30 – 11:50 |
Routing of Multi-Chiplet TSMC 3DFabric technologies
Cadence
/ AMD
|
New approach that targets EM/IR hotspot analysis and fixing with mPower and Calibre DesignEnhancer
Siemens EDA
|
| 11:50 – 12:10 |
Ansys-Synopsys-TSMC Solve the 3DIC Multiphysics Challenges
Synopsys
/ Ansys
|
Groundbreaking SRAM Repair Toolset: Pre-integrated Siemens Tessent MBIST with eMemory’s NeoFuse OTP
eMemory
/ Siemens EDA
|
| 12:10 – 12:30 |
Effective methods to reuse and automate bump creation for chiplets in 3DIC designs
Synopsys
/ AMD
|
Leveraging AI to accelerate debug with Calibre Design Solutions
Siemens EDA
|
| 12:30 – 13:30 |
Lunch & Ecosystem Pavilion |
| 13:30 – 13:50 |
A Collaborative Study on 2.5D System in Package for Better Quality and Reliability of High Bandwidth Memory
SK hynix
|
Low-Power Communication IC Design Verified by AI-Powered Simulation Flow
Siemens EDA
/ THine Electronics
|
| 13:50 – 14:10 |
Simplifying requirements and flows of SoIC technology for Stacked die design with TSMC 3Dblox and Cadence Integrity 3D-IC Platform
Cadence
/ GUC
|
AI Driven Layout Optimization For T-Coil Matching Networks
Ansys
/ AMD
|
| 14:10 – 14:30 |
GDDR Memory for High-Performance AI Inference
Cadence
/ Rambus
|
Insights into the Synopsys-TSMC UCIe IP on N5 and CoWoS Test Chip
Synopsys
|
| 14:30 – 14:50 |
3DIC Physical Implementation and SoIC-X Silicon Testing Results
GUC
|
Innovative design methodology for custom layout automation helping drive AI/ML
Cadence
|
| 14:50 – 15:20 |
Coffee Break & Ecosystem Pavilion |
| 15:20 – 15:40 |
Efficient 3D Chiplet Stacking Using TSMC SoIC Technology
Alchip
/ Synopsys
|
Die-to-Die Physical-Aware Interconnect Testing Using 3Dblox For Reduced Manufacturing Test Cost
Siemens DI SW
/ TSMC
|
| 15:40 – 16:00 |
A comprehensive IP validation methodology for Microsoft’s AI and high-performance compute chips
Siemens EDA
/ Microsoft
|
M31's Advanced MIPI Solutions on TSMC N5/N5A: Driving Efficiency and Performance in Automotive Applications
M31 Technology
|
| 16:00 – 16:20 |
Distributed and GPU-accelerated 3D EM Simulations for IC and 3DIC Silicon Photonics Applications with Peakview
Lorentz Solution
/ NVIDIA
|
New RISC-V Solutions for Infrastructure and Datacenters
SiFive
|
| 16:20 – 16:40 |
The Road Toward Unified-MultiPhysics-Design-Environment for High NA EUV Process Technology
National Taiwan University
|
From Specification to Layout: An AI-driven Automation Design Flow for Analog Circuits
National Taiwan University
|
| 16:40 – 16:55 |
Lucky Draw |
