|
Time
|
Plenary Session
|
| 08:30 – 09:30 |
Registration & Ecosystem Pavilion |
| 09:30 – 09:45 |
Welcome Remarks |
| 09:45 – 10:30 |
Enabling System Innovation & Guest Speech |
| 10:30 – 11:00 |
Coffee Break & Ecosystem Pavilion |
|
TSMC Technical Talks |
| 11:00 – 11:30 |
3Dblox 2024: Maximize 3DIC Design Productivity
TSMC
|
Energy efficient N2P and A16 SPR Technology Enablement
TSMC
|
AI-powered EDA Solutions for Design PPA, QoR and Productivity Enhancement
TSMC
|
|
OIP Partner Technical Talks |
|
3DFabric & 3Dblox Track |
HPC & Mobile Track |
Automotive, IoT & RF Track |
| 11:30 – 11:50 |
Effective methods to reuse and automate bump creation for chiplets in 3DIC designs
Synopsys
/ AMD
|
Leveraging AI/ML as the next leap to custom design automation
Cadence
/ Renesas
|
Analog and RF interfaces in future nanometer CMOS
University of Twente
|
| 11:50 – 12:10 |
3DIC Physical Implementation and SoIC-X Silicon Testing Results
GUC
|
Realizing benefits of Backside Power and Clock on TSMC A16 technology node
Synopsys
|
Realtime Safety Monitoring for Automotive Electronics based on Deep Data
proteanTecs
|
| 12:10 – 12:30 |
Routing of Multi-Chiplet TSMC 3DFabric technologies
Cadence
/ AMD
|
A comprehensive IP validation methodology for Microsoft’s AI and high-performance compute chips
Siemens EDA
/ Microsoft
|
A library-focused approach to standard cell IP evaluation and selection for automotive ICs
Siemens EDA
/ Infineon Technologies
|
| 12:30 – 13:30 |
Lunch & Ecosystem Pavilion |
| 13:30 – 13:50 |
Efficient 3D Chiplet Stacking Using TSMC SoIC Technology
Alchip
/ Synopsys
|
Thermal modeling of backside power delivery structure –- a N2 process case practice
Ansys
|
In memory compute in 16 nm finFET for energy efficient neural network acceleration.
KU Leuven MICAS
|
| 13:50 – 14:10 |
Distributed and GPU-accelerated 3D EM Simulations for IC and 3DIC Silicon Photonics Applications with Peakview
Lorentz Solution
/ NVIDIA
|
Low-Power Communication IC Design Verified by AI-Powered Simulation Flow
Siemens EDA
/ THine Electronics
|
Enabling a Battery-Free IoT Future: Sofics and ONiO Collaboration on Ultra-Low Leakage ESD Protection
Sofics
/ ONiO
|
| 14:10 – 14:30 |
Architecting next generations Terabit AI networks with Industry’s First Multi-Protocol I/O Connectivity Chiplet
Alphawave Semi
/ Arm
|
Groundbreaking SRAM Repair Toolset: Pre-integrated Siemens Tessent MBIST with eMemory’s NeoFuse OTP
eMemory
/ Siemens EDA
|
New approach that targets EM/IR hotspot analysis and fixing with mPower and Calibre DesignEnhancer
Siemens EDA
|
| 14:30 – 14:50 |
Multi-die design for TSMC COUPE with unified electronic and photonic design solutions
Synopsys
/ Ansys
|
AI Driven Layout Optimization For T-Coil Matching Networks
Ansys
/ AMD
|
AI-based RF design synthesis flow
Synopsys
|
| 14:50 – 15:20 |
Coffee Break & Ecosystem Pavilion |
| 15:20 – 15:40 |
Ansys-Synopsys-TSMC Solve the 3DIC Multiphysics Challenges
Synopsys
/ Ansys
|
On-Die High Accuracy Thermal and Voltage Sensing to lower system cost and reliability
Analog Bits
|
Leveraging AI to correctly identify critical corners for statistical .lib characterization on automotive cell libraries
Siemens EDA
/ Infineon Technologies
|
| 15:40 – 16:00 |
GDDR Memory for High-Performance AI Inference
Cadence
/ Rambus
|
New RISC-V Solutions for Infrastructure and Datacenters
SiFive
|
Ultra-Low-Power AI-Enabled Keyword Spotting Chips for Edge IoT
Delft University of Technology
/ Aalto University (Finland)
/ Leiden University (Netherlands)
|
| 16:00 – 17:00 |
Networking and Reception |
