The TSMC Open Innovation Platform^® Ecosystem Forum is a unique event that brings together the semiconductor design community and TSMC customers. The 2026 OIP Forum will feature multi-track technical presentation sessions along with an Ecosystem Pavilion. The Forum will provide an ideal venue to connect and build relationships with TSMC customers.

North America – OIP Ecosystem Forum

Date: Wednesday, September 23, 2026

Time: 9:30am – 6pm (Pacific Standard Time)

Venue: Santa Clara Convention Center, CA

Japan – OIP Ecosystem Forum

Date: Friday, November 6, 2026

Time: 9:30am – 5:30pm (Japan Standard Time)

Venue: Grand Hyatt Tokyo

Taiwan – OIP Ecosystem Forum

Date: Thursday, November 12, 2026

Time: 9:30am – 5:00pm (Taiwan Time)

Venue: Sheraton Hsinchu Hotel

China – OIP Ecosystem Forum

Date: Tuesday, November 17, 2026

Time: 9:30am – 5:00pm (China Standard Time)

Venue: Hyatt Beijing Wangjing

Europe – OIP Ecosystem Forum

Date: Tuesday, November 24, 2026

Time: 9:30am – 5:00pm (Central European Time)

Venue: Hilton Munich Airport

Israel – OIP Ecosystem Workshop

Date: Tuesday, December 1, 2026

Time: 10:30am – 4:30pm (Israel Daylight Time)

Venue: Bar-Ilan University

Call for Papers

The technical sessions at the global OIP Ecosystem Forums will be organized into two to three tracks, covering industry-leading logic, specialty & packaging technologies. These sessions will address applications in high-performance computing, smartphone, IoT, automotive and consumer electronics. Each track will consist of multiple 20-minute presentations.

Key benefits to you by presenting papers at TSMC's OIP Ecosystem Forum:

• Focused attention to your solutions from TSMC customer executives
• Increased opportunities to have in-depth discussions with TSMC customers from around the globe

We are seeking paper presentations that illustrate customer successes using your design solutions and TSMC technology, methodologies, and techniques.

The Technical Paper Review Committee will review the submitted abstracts, score them based on technical merit, uniqueness of solutions, ability to demonstrate how TSMC technology is integrated into your products or services, and quantifiable benefits to customer designs.

*IMPORTANT: Priority will be given to

• Joint papers with customers
• Papers with very strong technical depth

Submit an abstract aligned with 2026 Topics of Interest listed below for consideration at the OIP Ecosystem Forum!

2026 Topics of Interest

Disclaimer:

The decision to host the event will depend on prevailing circumstances, including logistical, environmental, and regulatory factors. We are committed to prioritizing the safety and well-being of all participants and may modify, postpone, or cancel the event if necessary.
Please note that the call for papers activity is a complimentary initiative and does not require any payment.

We look forward to your participation in this exciting event!

Abstracts are due May 8, 2026. For more information, please contact Ketan Joshi at kjoshia@tsmc.com.

 

Important Paper Submission Dates:

• Paper abstract and bio submission due – May 8
• Abstract review & final selection – May 9 – June 16
• Notification of selected abstracts – June 16
• Full draft presentation slide submission – July 31
• Final presentation slides due – Aug 21
• Final presentation slides recording submission – Sep 2
• OIP Ecosystem Forum North America – Sep 23
• OIP Ecosystem Forum Japan – Nov 6
• OIP Ecosystem Forum Taiwan – Nov 12
• OIP Ecosystem Forum China – Nov 17
• OIP Ecosystem Forum Europe – Nov 24
• OIP Ecosystem Workshop Israel – Dec 1

Application Form

Please go to Call for Papers Submission, fill in the form including supporting Abstract Slides to submit the paper abstract and speaker biography.

The views expressed in the presentations made at this event are those of the speaker and are not necessarily those of TSMC.