The TSMC Open Innovation Platform^® Ecosystem Forum is a unique event that brings together the semiconductor design community and TSMC customers. The OIP Forum will feature multi-track technical presentation sessions along with an Ecosystem Pavilion. The Forum provides an ideal venue to build relationships with TSMC customers. We have set the dates for our 2025 global OIP events, each with video on demand (VOD) access after the conclusion of the in-person events.

North America – OIP Ecosystem Forum

Date: Wednesday, September 24, 2025

Time: 9:30am – 6pm (Pacific Standard Time)

Venue: Santa Clara Convention Center, CA

Japan – OIP Ecosystem Forum

Date: Friday, October 24, 2025

Time: 9:30am – 5:30pm (Japan Standard Time)

Venue: Grand Hyatt Tokyo

Taiwan – OIP Ecosystem Forum

Date: Tuesday, November 18, 2025

Time: 9:30am – 5:00pm (Taiwan Time)

Venue: Sheraton Hsinchu Hotel

Europe – OIP Ecosystem Forum

Date: Tuesday, November 25, 2025

Time: 9:30am – 5:00pm (Central European Time)

Venue: Hilton Amsterdam Airport Schiphol

China – OIP Ecosystem Forum

Date: Thursday, December 4, 2025

Time: 9:30am – 5:00pm (China Standard Time)

Venue: Shangri-La Nanjing

Israel – OIP Ecosystem Workshop (Cancelled)

Date: Tuesday, December 2, 2025

Time: 10:30am – 4:30pm (Israel Daylight Time)

Venue: Bar-Ilan University

Call for Papers

The technical sessions at the global OIP Ecosystem Forums are organized into two to three tracks focusing on High-Performance Computing, 3DIC, Mobile, Automotive, IoT and RF. Each track covers multiple 20 minutes presentations.

Key benefits of participating in TSMC's OIP Ecosystem Forum are:

• Exclusive one-on-one access to TSMC customer executives at the director level or above.
• Increased opportunities to engage in in-depth discussions with TSMC customers from around the globe.

We are seeking paper presentations that illustrate your design solutions and customer successes with TSMC solutions, methodologies, and techniques.

The Technical Paper Review Committee will review the submitted abstracts, score them based on their merit and their ability to demonstrate how TSMC technology is integrated into your products or services, and make the final selections for in-person presented papers and online-only papers.

*IMPORTANT: Priority will be given to joint papers with your customers and papers aligned with 2025 Topics of Interest listed below.

Submit an abstract for consideration at the 2025 OIP Ecosystem Forum!

2025 Topics of Interest

Important Paper Submission Dates:

• Paper abstract and bio submission due – June 13
• Abstract review & final selection – June 14 – July 6
• Notification of selected abstracts – July 7
• Full draft presentation slide submission – Aug 1
• Final presentation slides due – Aug 22
• Final presentation slides recording submission – Sep 1
• Presentation Rehearsal (Recorded Video or Live) – Sep 8 - 19
• OIP Ecosystem Forum NA – Sep 24
• OIP Ecosystem Forum Japan – Oct 24
• OIP Ecosystem Forum Taiwan – Nov 18
• OIP Ecosystem Forum Europe – Nov 25
• OIP Ecosystem Forum China – Dec 4

Application Form

Please go to Call for Papers Submission and fill in the form to submit the abstract and speaker biography.

The views expressed in the presentations made at this event are those of the speaker and are not necessarily those of TSMC.

Disclaimer:

The decision to host the event will depend on prevailing circumstances, including logistical, environmental, and regulatory factors. We are committed to prioritizing the safety and well-being of all participants and may modify, postpone, or cancel the event if necessary.
Please note that the call for papers activity is a complementary initiative and does not require any payment.

Abstracts are due June 13, 2025. For more information, please contact Ketan Joshi at kjoshia@tsmc.com.